Thermal and Performance Engineer, Commercial PCs

2 days ago


TPC NanKang Software Park III Taipei TPC, Taiwan HP Full time $120,000 - $180,000 per year
Thermal and Performance Engineer, Commercial PCs

Description -

Job Description

Are you ready to shape the future of Thermal and Performance Engineering?

This role brings deep domain expertise in thermal and mechanical systems, offering strategic leadership and technical guidance to ensure optimal performance across projects. You will evaluate designs for compliance with engineering standards and drive the adoption of innovative technologies to enhance thermal efficiency and mechanical reliability.

Key Responsibilities:

  • Leads multiple project teams of other Thermal hardware engineers and internal and outsourced development partners responsible for all stages of thermal development for complex products and platforms, including solution design, validation, tooling and testing.

  • Lead and execute system thermal design and influence product definition to ensure market competitiveness and future-proof.

  • Manages deliverables, schedules, and costs for multiple ongoing projects, ensuring that resources are appropriately allocated and that goals, objectives, timelines, and budgets are met in accordance with program and organizational roadmaps.

  • Manages and expands relationships with internal and outsourced development partners on mechanical and thermal design and development.

  • Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality.

  • Provides domain-specific expertise and overall thermal leadership and perspective to cross-organization projects, programs, and activities.

  • Interprets internal/external business challenges and recommends best practices to improve products, processes or services.

  • Develops and implements parameters and test plans for new and existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics.

  • Collaborates and communicates with management, internal, and outsourced development partners regarding design status, project progress, and issue resolution.

  • Represents the thermal team for all phases of larger and more-complex development projects.

  • Drives innovation and integration of new technologies into projects and activities in the thermal design through HW/FW developments.

Education & Experience Recommended

  • Four-year or Graduate Degree in Mechanical Engineering, or any other related discipline or commensurate work experience or demonstrated competence.

  • 6+ years of work experience in thermal engineering in PC related product., preferably in engineering design and solutions, implementation across hardware development lifecycle, or a related field.

Knowledge & Skills

Experience with fan, heat pipe, and vapor chamber design Experience in developing thermal solution for high performance computing systems Using Flotherm, Ansys or other thermal CFD modeling tools Using CFD and thermal mockups to validate thermal solution.

  • 3D Modeling

  • Ansys Simulation Software

  • Computer-Aided Design

  • Electromechanics

  • Engineering Design Process

  • Finite Element Methods

  • Injection Molding

  • Machining

  • Manufacturing Processes

  • Mechanical Design

  • Mechanical Engineering

  • Mechanical Systems

  • New Product Development

  • Product Design

  • Product Lifecycle Management

  • Prototyping

  • PTC Creo (CAD Suite)

  • Sheet Metal

  • SolidWorks (CAD)

  • Thermal Management

Cross-Org Skills

  • Effective Communication

  • Results Orientation

  • Learning Agility

  • Digital Fluency

  • Customer Centricity

Impact & Scope
Impacts function and leads and/or provides expertise to functional project teams and may participate in cross-functional initiatives.

Complexity
Works on complex problems where analysis of situations or data requires an in-depth evaluation of multiple factors.

Disclaimer
This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (Taiwan)

Travel -

Relocation -

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP's EEO Policy or read about your rights as an applicant under the law here: "Know Your Rights: Workplace Discrimination is Illegal"



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