Senior Packaging Engineering Director in Consumer Electronics

2 weeks ago

Taipei, Taiwan Shanghai BSF Human Resources Co., Ltd Full time
About Shanghai BSF Human Resources Co., Ltd

We are a dynamic team within the consumer electronics industry, seeking a highly qualified Package Process Engineering leader to join our organization.

Job Summary

This role involves overseeing the development and modification of our technical management system and process standards, including safety regulations. The ideal candidate will possess a robust background in package development and engineering, coupled with specialized knowledge of Apple's packaging products and processes.

Key Responsibilities:
  • Research and Analysis: Conduct research on technology trends in the industry and competitors to formulate strategic development plans.
  • Technical Management: Develop and modify our technical management system and process standards, including safety regulations.
  • New Technology Implementation: Oversee the introduction of new technologies and product development to expand product variety.
  • Project Participation: Engage in equipment selection, trial production, and process design for new product projects.
  • Problem Solving: Address and coordinate solutions for technical issues during production and sales.
  • Strategic Planning: Lead the planning and implementation of initiatives related to new materials, processes, and automation, setting improvement goals.
  • Technical Seminars: Organize and participate in seminars to define development directions and technical frameworks.
  • Project Leadership: Effectively lead project teams and manage priority initiatives to improve processes and outcomes.
  • Personnel Management: Train and assess department personnel, ensuring they fulfill their responsibilities.
Requirements
  • Experience: At least 10 years of package development or engineering experience, ideally in a key role within the consumer electronics sector.
  • Familiarity with Apple Products: Applicants should be well-versed in the manufacturing processes, automated machinery, and materials used in Apple's packaging solutions.
  • Educational Background: A bachelor's degree in Engineering or a package-related field is required.
  • Relocation: The position requires the candidate to be open to relocating to Mainland China for a long-term commitment.
  • Communication Skills: Experience in directly communicating with key personnel involved in Apple's packaging products or engineering processes is preferred.
Compensation and Benefits

The estimated annual salary for this role is around ¥800,000 - ¥1,200,000 (approximately $110,000 - $170,000 USD), depending on experience and qualifications. Additionally, we offer comprehensive benefits packages, including health insurance, retirement plans, and paid time off.

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