Sr. Packaging Engineer, Design

Description
Synaptics is leading the charge in AI at the Edge, bringing AI closer to end users and transforming how we engage with intelligent connected devices, whether at home, at work, or on the move. As the go-to partner for the world's most forward-thinking product innovators, Synaptics powers the future with its cutting-edge Synaptics Astra AI-Native embedded compute, Veros wireless connectivity, and multimodal sensing solutions. We're making the digital experience smarter, faster, more intuitive, secure, and seamless. From touch, display, and biometrics to AI-driven wireless connectivity, video, vision, audio, speech, and security processing, Synaptics is the force behind the next generation of technology enhancing how we live, work, and play.

Overview
Our Sr. Packaging Engineer, Design & NPI is instrumental in supporting a diverse product portfolio through the design, development, and introduction of advanced IC packaging technologies. This role spans electrical, thermal, and mechanical design and analysis, guiding the definition of package specifications and performance benchmarks. You will be actively involved from early concept and design stages through to mass production, interfacing cross-functionally with internal teams and OSAT partners. This position reports to the Package Engineering Manager.

Responsibilities & Competencies
Job Duties

• Drive package design and new product introduction (NPI) across diverse packaging technologies, including wire bond, flip-chip, WLCSP, MCM, and FOWLP
• Support silicon-package co-design efforts by working closely with cross-functional teams including Systems Engineering, IC design, and Marketing, and Planning
• Partner with OSAT vendors during NPI and ramp-to-manufacturing phases to ensure quality, cost, and delivery targets are met
• Actively participate in core team meetings and provide packaging guidance to internal business and product units
• Conduct trade-off analysis to optimize design for cost, reliability, yield, and manufacturability
• Proactively address packaging-related challenges and continuously identify opportunities for process improvements.
• Collaborate with reliability, assembly, and simulation teams to develop and execute DoE plans, assess yield and performance data, and deliver robust package solutions
• Define and validate thermal, mechanical, and electrical performance through detailed analysis and simulation

Competencies

• Proficient with Cadence APD/SIP, AutoCAD, and other packaging CAD tools
• Knowledge of signal and power integrity, especially for high-speed memory and video interfaces
• Strong understanding of HDI substrate technologies, layout design rules, and materials for optimal performance
• Familiarity with SMT processes and board-level integration best practices
• Knowledgeable in assembly process flows and package-to-board reliability engineering
• Skilled in flip-chip bumping techniques including Cu pillar, solder bumping, and u-bumping
• Analytical and able to make informed decisions based on experience
• Proactive, self-starter, able to work independently in a fast-paced environment
• Well organized with strong attention to detail; proactively ensures work is accurate
• Positive attitude and work ethic; unafraid to ask questions and explore new ideas
• Resourceful and able to solve problems through adapting technology and a solid understanding of product architecture
• Good verbal and written communication skills English and Mandarin (spoken and written)
• Strong team player with the ability to work within a diverse team

Qualifications (Requirements)

• Bachelor's degree (Master's preferred) in Mechanical Engineering, Materials Science & Engineering, Electrical/Computer Engineering, or a related field or equivalent
• 5+ years of hands-on experience in package design and NPI
• Demonstrated experience in organic substrate and lead frame-based routing feasibility studies
• Proven track record in designing and executing Design of Experiments (DoEs) for yield, performance, or reliability enhancement
• Experience with thermal analysis and heat dissipation design techniques
• Travel up to 10% may be required.

*Belief in Diversity

Synaptics is an Equal Opportunity Employer committed to workforce diversity. Qualified applicants will receive consideration without regard to race, sex, sexual orientation, gender identity, national origin, color, age, religion, protected veteran or disability status, or genetic information.*