相关搜索

台灣packaging engineer职位632个。每日更新。


  • Hsinchu Metropolitan Area, 台灣 AMD 全职

    **ADVANCE YOUR CAREER. ADVANCE THE WORLD.** At AMD, we believe technology can change lives for the better. It can heal us, entertain us, and make us more connected, productive, and understanding of the world around us. And we’re looking for talent who feel the same: people who want to leave the planet better than they found it, those who don’t shy away...


  • Hsinchu, 台灣 AMD 全职

    ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI...


  • Hsinchu, 台灣 Advanced Micro Devices, Inc 全职

    ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI...


  • Hsinchu, 台灣 NVIDIA 全职

    At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Senior Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC...


  • Zhubei, Hsinchu County, 台灣 onsemi 全职

    DescriptionJob Summary: As a member of the Advanced Packaging team, you will manage various aspects of image sensor packaging technology development, process improvement, and new product introduction including CSP, BGA, LGA and related packages for sensing systems utilized in Automotive, Industrial and Consumer applications.  You will directly support and...


  • Hsinchu, 台灣 Eridu 全职

    Job SummaryWe are seeking a Senior Advanced Packaging Engineer based in Taiwan to support the development, integration, qualification, and manufacturing readiness of advanced CoWoS-based, multi-die chiplet packaging for next- generation AI and high-performance computing products. This individual will serve as the primary local engineering interface with...


  • Hsinchu, 台灣 聯發科技 全职

    Job Description • CoWoS and 2.5D package technology development 2. 3D package technology development 3. CPC/CPO package technology development 4. Mobile/WiFi/TV/Automotive package development 5. Package technology integration and NTO handle 6. Package design/SIPI/Layout 7. Package Modeling Main Requirements and Qualifications • 1. Advanced package...


  • Zhubei, Hsinchu County, 台灣 onsemi 全职

    DescriptionLead the development, qualification, and manufacturing release of advanced flip-chip packaging solutions, including substrate-based (FC-BGA, FC-LGA) and leadframe-based technologies. Drive package development from concept through production while working closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and...


  • Hsinchu,, 台灣 MediaTek 全职

    **Job Description** - CoWoS and 2.5D package technology development 2. 3D package technology development 3. CPC/CPO package technology development 4. Mobile/WiFi/TV/Automotive package development 5. Package technology integration and NTO handle 6. Package design/SIPI/Layout 7. Package Modeling **Main Requirements and Qualifications** - 1. Advanced package...


  • Hsinchu, 台灣 NVIDIA 全职

    We are now looking for a Senior Packaging Technical Engineer. NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of...


  • Hsinchu, 台灣 Marvell Technology 全职

    About MarvellMarvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel...


  • Hsinchu, 台灣 NVIDIA 全职

    The NVIDIA Networking IC Co-Packaged Optics Engineering team is seeking an experienced Senior Optical Process Engineer for co-packaged optics products. This role involves close collaboration with various IC Product Engineering teams, including hardware, test engineering, and product engineering, as well as the Operations team and leading semiconductor...

  • SiC Wafer

    11小时前


    Zhubei, Hsinchu County, 台灣 onsemi 全职

    DescriptionTechnical and customer support for the qualification of SiC die sales and development. The candidate must have knowledge of package design, assembly processes and interactions with device.Responsibilities Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and...


  • Hsinchu, 台灣 ASM 全职

      Step into a career with ASM, where cutting edge technology meets collaborative culture. ​ For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in...


  • Hsinchu, 台灣 聯發科技 全职

    Job Description • Advanced process technology development 2. Advanced package technology development Main Requirements and Qualifications • 1. 7nm/5nm/3nm/2nm advanced technology research/development experience • 2. Advanced device technology development (semiconductor device physic) • 3. Advanced YE & FA technology development (IP test chips...


  • Hsinchu, 台灣 ERS electronic GmbH 全职

    Based in Hsinchu, Taiwan. Tasks And Responsibilities • Equipment Demonstration: Conduct in-depth equipment demonstrations tailored to the specific needs of potential clients. • Technical Training: Train both internal teams and external customers on equipment functionalities and best practices. • Customer Requirement Analysis: Analyse customer...


  • Hsinchu,, 台灣 MediaTek 全职

    **Job Description** - Advanced process technology development 2. Advanced package technology development **Main Requirements and Qualifications** - 1. 7nm/5nm/3nm/2nm advanced technology research/development experience - 2. Advanced device technology development (semiconductor device physic) - 3. Advanced YE & FA technology development (IP test chips...


  • Hsinchu, 台灣 Merck 全职

      與我們攜手施展你的超能力!     準備好接受挑戰,探索更多可能性嗎? 我們跟你一樣希望精益求精,持續突破!...

  • SiC Wafer

    7天前


    Hsinchu, 台灣 安森美半导体 全职

    Job Description Technical and customer support for the qualification of SiC die sales and development. The candidate must have knowledge of package design, assembly processes and interactions with device. Responsibilities • Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to...


  • Hsinchu, 台灣 Cirrus Logic 全职

    For over four decades, Cirrus Logic has been propelled by the top engineers in mixed-signal processing. Our rockstar team thrives on solving complex challenges with innovative end-user solutions for the world's top consumer brands. Cirrus Logic is also known for its award-winning culture, which was built on a foundation of inclusion and fairness, meaningful...