Package/System Design Solution Engineer, Senior

1 week ago

Hsinchu City, Taiwan Qualcomm Full time $90,000 - $120,000 per year
Job Description:
General Summary:Job Responsibilities
  • Package selection, package design, and package electrical modeling.
  • Optimizing system co-design of IC-PKG-PCB die with package footprint/height constraints, IC floor-planning, PCB, signal integrity, RF, power distribution network, and thermal constraints.
  • Collaborating with cross-functional teams to ensure seamless integration of package designs with overall system requirements and performance goals.
  • Utilizing 3D/2D EM simulation tools to analyze and optimize package designs for electrical performance and signal integrity.
Preferred Qualifications
  • At least 3 years of experience in a similar role, with a focus on advanced packaging technologies such as flip-chip, wafer-level packaging, QFN and 3D integration.
  • Proficiency in design tools such as Cadence, Mentor Graphics, or similar.
  • Expertise in 3D/2D EM simulation tools for package design and analysis.
  • Strong understanding of signal integrity, power integrity, and thermal management.
  • Familiar with assembly and substrate manufacturing process
  • Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
  • Familiar with PCB stack-up and breakout strategy
  • Effective communication skills to articulate complex technical concepts as a team player with solution prepared.
Educational Requirements
  • Bachelor's or Master's degree in Electrical or Mechanical Engineering, Materials Science, or a related field.
  • Master's, Electrical Engineering is preferred.

Qualcomm

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