Advanced Package Diagnostics Engineer, Staff(Hsinchu)

Company
Qualcomm Semiconductor Limited

Job Area
Engineering Group, Engineering Group > ASICS Engineering

General Summary
As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives communication and data processing transformation to help create a smarter, connected future for all. As a Qualcomm ASIC Engineer, you will define, model, design (digital and/or analog), optimize, verify, validate, implement, and document IP (block/SoC) development for a variety of high performance, high quality, low power world class products. Qualcomm Engineers collaborate with cross-functional groups to determine product execution path.

Minimum Qualifications

• Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.

OR

Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.

OR

PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.

As semiconductor packaging technologies become increasingly complex such as 2.5D and 3DIC, the demand to quickly isolate sources of failure whether from individual chips or chiplets, interconnects, or weaknesses in the manufacturing/assembly processes becomes an even more critical element in delivering cost-effective solutions. We are seeking a highly skilled and innovative engineer to lead the development of new diagnostics & analytical methodologies to isolate sources of semiconductor package failures. This role goes beyond traditional failure analysis strategies—requiring creativity, cross-disciplinary thinking, and the development of novel package design features, test algorithms, and software diagnostic technologies that do not yet exist. The ideal candidate will be a creative problem-solver with a strong background in semiconductor packaging, data analytics, and cross-functional collaboration.

Key Responsibilities
Develop advanced diagnostic methodologies to identify root causes of package failures using electrical test results, software simulation and/or fault models.

Develop advanced analytics & machine learning systems which integrates product characteristics, electrical test responses, and packaging manufacturing data to quickly identify sources of failure in advanced & conventional semiconductor chip packages

Develop data and analytical systems for assembly and substrate manufacturing processes, including defining data requirements and transfer protocols for OSATs, contract manufacturers, and substrate suppliers.

Qualifications
M.S. or Ph.D. in Electrical Engineering, Materials Science, Applied Physics, or a related field.

Strong understanding of semiconductor packaging design, material & assembly processes, electrical test methodologies, and failure diagnostics.

Proficiency in data analytics, statistical modeling, and machine learning techniques.

Demonstrated experience in developing innovative solutions to complex, open-ended engineering problems.

Excellent communication skills and the ability to work independently in a fast-paced, exploratory environment.

Travel to OSAT facilities in Taiwan and other Asian countries

Preferred Qualifications
Experience working with OSATs or in a high-volume manufacturing environment.

Familiarity with advanced packaging technologies (e.g., 2.5D/3D IC, fan-out, etc.).

Applicants
: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability- or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

To all Staffing and Recruiting Agencies
: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

If you would like more information about this role, please contact Qualcomm Careers.