APTD Package Integration Engineer

7 hours ago


Taichung, Taiwan Micron Technology Full time $60,000 - $120,000 per year

Responsible for HBM project (high-bandwidth memory) electric yield calculation for routing review and automation script development. Work with the wafer fab process/ integration group to address process-related defects affecting electric yield Work closely with probe and test related groups. Work closely in conjunction with the APTD process team to set-up experiments using DOE, monitoring progress of changes, and statistical analysis of results Masters or Bachelor's degree in Engineering Strong logical thinking, as applied to general programming and problem solving. English skills and ability to work in a multi-national multi-functional team. Semiconductor manufacturing process (Front-end wafer process / Wafer Probe / Back-end assembly process / Back-end Test Either one, the more the better) Skills and proficiency in statistical analysis/method like JMP/Mini-Tab/Yield3 analytic tools Proficiency in critical computer applications like Excel, Word, Power Point Python or Excel macro familiarity or experience Strong written and verbal communication skills 3 years working experience in semiconductor industry NPI flow and APQP process Semiconductor Wafer/Package Failure Analysis (PFA/EFA) Package Reliability Semiconductor device knowledge Knowledge of fundamental electrical engineering test, as applicable to memory devices and test hardware Knowledge of digital systems and digital logic Basic Unix/Linux terminal C/C++ Python familiarity or experience



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