Senior R&D Package design Engineer

22 hours ago


Zhubei, Taiwan onsemi Full time NT$900,000 - NT$1,200,000 per year
  • Lead imager package product design activities including: schematic and package netlist definition; package circuit layout; package simulations; package design review and approval; and package product performance verification.
  • Provide direct design support for imager package product designs including wire bond BGA/LGA/PGA, MCP (multichip package), flip chip package and WLCSP (wafer level chip scale package).
  • Work directly with Product Design, Design Integration, Product Engineering, Test Engineering, Applications Engineering, Hardware Development, Marketing, Packaging R&D, Packaging NPD, Purchasing, OSAT's, and key package material suppliers.


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