Assembly Process Engineering Director

11 hours ago

Kaohsiung City, Taiwan NXP Semiconductors Full time NT$120,000 - NT$180,000 per year

Role Summary:

  • leading and managing all the activities of Assembly Process in AT Kaohsiung, working together with various groups (particularly Manufacturing, Equipment, and Packaging Innovation) to meet business objectives.

Job Responsibility:

  • Management Team member of NXP Kaohsiung to drive site decision aligning with NXP values and mission.
  • Drive process standardization, best practices, and talent retention & growth for organization sustainability
  • Establishing & maintaining the production standard work meeting process control requirements
  • Own & drive area KPIs to meet performance target (Safety, Quality, Delivery, Costs, Yield)
  • Define, develop and establish process capabilities, strategy and roadmap
  • Develop a strategy to develop new capabilities or to overcome process constraints
  • Collaborate with Innovation NPI/NTI team to enable successful NPI/NTI launch with robust Safe Launch closure
  • Attend and own all BCAM related review on NPI/NTI to ensure risk to process margin/manufacturability is mitigated upfront
  • Constantly on the lookout for new material suppliers / new technology and capability
  • Specifically on risk assessment and process flow optimization, playing the Integrator role of Assembly process from wafer to package finished good
  • Ensure business continuity in process, working with Purchasing to identify critical suppliers and develop 2nd sourcing strategy
  • Maintain a matrix on process capabilities and constraints
  • Work with UG/Equipment counterpart on equipment benchmarking

Job Qualification:

  • Bachelor Degree in relevant engineering fields
  • 15 + Years of Experience in Semiconductor industry is mandatory
  • Competent in NPI development, quality, or problem solving skill will be added advantage
  • Experience with various DOE methodology, proficient in statistical tools for decision making, knowledgeable in JMP software or equivalent
  • Knowhow in wire bond technology including bonding diagram analysis, Cu wire bonding, and engagement with equipment team on Wirebonder MTBA improvement
  • Experience in running engineering teams in wire bond, die bond, or mold
  • Strong leadership skills with good communication
  • Excellent data analysis and data interpretation skills
  • Ability to make sound data-driven decisions
  • Hands on, strong ownership, and able to collaborate as team player

Key Competencies most required include:

  • Drives Results
  • Problem Solving
  • Manages Ambiguity
  • Collaborates

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