APTD Package Integration Engineer

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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

職務說明

Micron currently has an opening for HBM package integration engineer in the Advanced Packaging Technology Development (APTD) organization located in Taichung. As a HBM package integration engineer you will be part of the PI group responsible for driving development and introduction of new process solutions to the HBM (high bandwidth memory )that will be implemented in advanced stacked DRAM memory products. And subsequent improvement in for electric yield and product reliability including C3D/C4D/ AQLK analysis to drive and help process engineer to prepare for its transfer to manufacturing.

IN ABOVE RULE, SUCCESSFUL CANDIDATES for THIS POSITION MUST DEMONSTRATE:

• Responsible for HBM project (high-bandwidth memory) electric yield calculation for routing review and automation scrip development.
• Utilize statistical tools for detailed data analysis for electric yield improvement projects
• Work with the wafer fab process/ integration group to address process-related defects affecting electric yield
• Work closely with probe and test related groups.
• Use project management skills to ensure timely completion of projects
• Own the assembly portion of the product manufacturing process flow during development of new product introduction (NPI) in MTB
• Work closely in conjunction with the APTD process team to set-up experiments using DOE, monitoring progress of changes, and statistical analysis of results
• Publish module updates, key project status updates, best known methods, and lessons learned

Basic Requirement

• Masters or Bachelor's degree in Engineering
• Strong logical thinking, as applied to general programming and problem solving.
• English skills and ability to work in a multi-national multi-functional team.
• Semiconductor manufacturing process (Front-end wafer process / Wafer Probe / Back-end assembly process / Back-end Test Either one, the more the better)
• Skills and proficiency in statistical analysis/method like JMP/Mini-Tab/Yield3 analytic tools
• Proficiency in critical computer applications like Excel, Word, Power Point
• Python or Excel macro familiarity or experience
• Strong written and verbal communication skills

At least 3 of below major skill, additional would be considered as Bonus :

• 3 years working experience in semiconductor industry
• NPI flow and APQP process
• Semiconductor Wafer/Package Failure Analysis (PFA/EFA)
• Package Reliability
• Semiconductor device knowledge
• Knowledge of fundamental electrical engineering test, as applicable to memory devices and test hardware
• Knowledge of digital systems and digital logic
• Basic Unix/Linux terminal
• C/C++ Python familiarity or experience

About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life
for all
. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

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