RF Manufacturing Product Engineer
24小时前
Hsinchu, 台灣
RGP
全职
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你好, 我是負責做人事招募的劉小姐, 目前我正在找尋Manufacturing Product Engineer, 請看以下工作說明, 並也歡迎隨時與我聯繫, 感謝
這個職位主要負責半導體產品從開發到量產階段的工程工作,包括產品量產導入、良率分析、RF測試問題排除、跨部門專案協調,以及產品可靠度驗證與失效分析等相關工作。
As a Manufacturing Product Engineer at MACOM Technology Solutions, you will be responsible for the successful transition of semiconductor products from development to volume production. You will collaborate with cross-functional teams, including design, process engineering, RF test engineering, and quality assurance, to optimize manufacturing processes, troubleshoot issues, and drive continuous improvement to meet production goals and maintain product quality.
•Support RF Test Engineering and Product Engineering groups to assure technical, cost, and schedule goals are met for implementation of new product test solutions and continuous improvement activities.
•Support Manufacturing OSAT and in-house Operations with RF Engineering expertise and problem-solving skills to solve challenges associated with production RF and Millimeter wave testing.
•Coordinating cross-functional engineering activities as a technical for new product releases and continuous improvement activities.
•Perform yield analysis, electrical data analysis, and statistical trend monitoring to identify root causes of performance and quality issues.
•Support product reliability qualification activities, including planning, execution, analysis, and reporting.
•Drive continuous improvement initiatives focused on yield enhancement, test time reduction, cost reduction, quality improvement, and manufacturing efficiency.
•Maintain product documentation, qualification records, manufacturing change documentation, and engineering reports throughout the product lifecycle.
Note: This is a non-exhaustive list of duties and responsibilities. Other tasks will be assigned during the course of your employment.
我們希望尋找具備以下背景的人才:
半導體相關產業經驗(Product / Manufacturing / Test / Reliability Engineer)
熟悉產品量產導入(NPI)、良率分析或量產品質改善
具可靠度驗證經驗者尤佳(HTOL、HAST、THB、TC、MSL 等)
具 Failure Analysis (FA) 或 Root Cause Analysis 經驗加分
熟悉 RF、Analog、Mixed Signal 或化合物半導體產品者加分
具備跨部門溝通與專案協調能力
此職缺屬於工程師職級,不需要帶人,但希望能獨立負責產品相關專案與量產工作。
Yolanda Liu劉兆嵐
Senior Director, Client Development
RGP 眾弘企業股份有限公司
TEL:+886-2-2700-6049 EXT.704
Mobile:+886-972-295-507
E-MAIL: yolanda.liu@rgp.com
LINE: yolandaliu66 Wechat: yolandaliu66
10683臺北市信義路四段6號13樓之2
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