功率模組開發NPI (Power Module) 資深工程師

3 days ago

Hsinchu County, Taiwan ARK HDPS SEMICONDUCTOR LTD. Full time NT$900,000 - NT$1,200,000 per year

此職務擔任本公司艾科半導體(專注於高密度電源設計)的封裝模組的工程師

責任

此職務擔任本公司ARK(IC電源設計)的封裝模組的工程師,與前端RD合作、並接口應對的封裝廠。

負責電源模組製程開發 (包括材料、機台、治具的開發與優化)

並
提供產品封裝及模組化的專業知識與建議,並涉及前瞻性開發任務。

資格

1.熟悉電源類IC封裝/PI+UBM/BGBM...等製程

2.了解模組電路板/基板/導線架佈局設計

3.具高密度電源模組設計生產經驗尤佳

4.具備產品不良異常分析與改善能力

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