External Manufacturing NPI Engineer

1 week ago


Zhubei, Taiwan onsemi Full time NT$2,000,000 - NT$2,500,000 per year

Job Description
Job Summary:
We are looking for a skilled NPI Engineer to join our External Manufacturing team with a focus on wafer-level packaging (WLP) and post-foundry solutions. In this role, you will leverage your strong expertise and extensive technical network to develop new capability requirements, shape manufacturing strategies, and deliver advanced solutions for next-generation silicon technology and WLP solutions.

Responsibilities

  • Own backend external manufacturing NPI from conceptualization, development, qualification to production launch with a focus on wafer-level packaging (WLP) and post-fab solutions
  • Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
  • Drive DFM, technology & manufacturability readiness for new product/ package development, effective POR freeze for new product introduction
  • Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include BOM & process setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
  • Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
  • Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
  • Adoption of data analytics and data-driven approach to problem solving and decision making
  • Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
  • Participate in quality and process readiness audit to achieve production site readiness
  • Co-work with operations to drive continuous yield improvement for evolving challenges
  • Subject Matter Expert to address arising package and assembly challenges
  • Experienced candidate(s) will be considered for lead role to manage team activities

Qualifications

  • Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
  • More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
  • Hands-on experience in wafer-level packaging (WLP) and post-fab solutions including electroless & electrolytic plating and other surface finishing technology
  • Familiar with plating chemistry/ process and material/ metallurgy characterization & microstructural analysis
  • Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
  • Experience in IC package design/ CAD/ FEA simulation/ characterization will be advantageous
  • Good overall understanding of OSAT business landscape and operations
  • Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
  • Strong project management skills and multi-stakeholder management
  • Proficient in statistical analysis methods and familiar with data analytics

About Us
onsemi
(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

About The Team
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.



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