Process Integration Engineer

2 weeks ago


Taoyuan City Taoyuan City, Taiwan Apple Full time

Summary
At Apple, we believe our products begin with our people. By hiring a team with varied strengths, we drive creative thought. By giving that team everything they need, we drive innovation. By hiring incredible engineers, we drive precision. And through our collaborative process, we build memorable experiences for our customers.nnThese elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Will you help us design the next generation of revolutionary Apple products?

Description
You will bring deep hardware understanding, strong technical curiosity, and crisp engineering judgment to drive root-cause clarity, design changes, and new module development with suppliersnDrive supplier accountability: convert ambiguous tool behavior into clear problem statements, structured hypotheses, and closed-loop corrective actions.nLead subsystem-level Root Cause Analysis (RCA) and influence solutions across precision mechanics, motion interfaces, vacuum/pneumatics, dispense/fluid paths, chucks/fixtures, alignment mechanisms, and contamination control.nReview and approve supplier proposals (redlines, tolerances, materials/finishes, retrofits, PM changes) to ensure robust, production-ready outcomes.nGuide new equipment/module development with suppliers: requirements, risk analysis, design reviews, verification strategy, and acceptance criteria from concept through pilot.nCommunicate with discipline: technical write-ups, design review feedback, change control artifacts, and executive-ready status summaries.

Minimum Qualifications
BS in Mechanical Engineering, Material Science, Optics, Engineering Physics, Physics or related field with a minimum of 5 years relevant industry experience nOutstanding written and oral communication skills in English nDemonstrated ability to lead and coordinate a multi-functional teamnTechnical expertise, hands-on experience and consistent track record in new process/ hardware design and development, semiconductor process integration nProven ability to drive outcomes through suppliers and cross-functional partners.nDemonstrated ability to drive supplier execution through data-driven analysis, crisp problem statements, and strong technical judgment.

Preferred Qualifications
MS or PhD in Material Science, Mechanical Engineering, Optics, Engineering Physics, Physics or equivalentnExpertise in sophisticated process technology development, and associated equipments u0026 process enablement including semiconductor manufacturing. nExperience in design of experiments and corresponding statistical data analysisnKnowledgeable of thin film deposition and corresponding metrology methods (ex. PVD, CVD, ALD, XPS, SEM, TEM, AFM, and XRD, etc.)nKnowledgeable of DUV Lithography or Nano-imprint Lithography. nExperience participating in equipment development lifecycle (requirements → design reviews → verification plan→ FAT/SAT criteria, and readiness)nStrong mechanical fundamentals: tolerance/fit, precision mechanisms, materials/finishes, wear/particle generation drivers, thermal/mechanical stability, and design-for-reliability principles.nAbility to connect mechanical behavior to process impact in PR coat/develop and bonding workflows.nFamiliarity with photoresist coating process context (dispense/spin/EBR/bake handling) sufficient to connect mechanical behavior to process impact.nComfortable reading drawings and specifications; ability to challenge assumptions and identify hidden coupling risks across modules.



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