COUPE Design and Flow Development Manager

17 hours ago


Hsinchu City, Taiwan TSMC Full time NT$1,200,000 - NT$2,400,000 per year

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers' products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world's largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

We are seeking a highly skilled and motivated System Integration and Design Flow Manager to join our advanced COUPE (Compact Universal Photonic Engine) design flow team. The ideal candidate will bring strong expertise in silicon photonics tape-out, physics of photonic devices, and hands-on experience with EDA tools. This role will directly support the integration of photonic engines into 3DIC infrastructure, enabling next-generation optical/electrical COUPE technologies and supporting strategic customer programs.

Job Responsibilities:

  1. Design, simulate, and analyze optical, analog, and RF circuits for COUPE applications.

  2. Develop and scale bandwidth in simulations for next-generation optical chip design.

  3. Collaborate with the process R&D, EDA partners, and cross-functional teams to drive DTCO/STCO efforts.

  4. Integrate COUPE optical engines into 3DIC structures to support high-bandwidth transceiver applications.

  5. Enhance design flows and verification processes to ensure alignment with customer requirements.

  6. Contribute to long-term Co-Packaged Optics (CPO) technology roadmap and system-level integration projects.

Job Qualifications:

Minimum Qualifications

  1. Master's or Ph.D. degree in Optoelectronics, Electrical Engineering, or a related field.

  2. Proven silicon photonics tape-out experience.

  3. Strong knowledge of physics of photonic devices and semiconductor fundamentals.

  4. At least 15+ years of experience in circuit design, device modeling, and use of EDA tools.

  5. Excellent problem-solving and collaboration skills in fast-paced environments.

Preferred Qualifications

  1. Familiarity with scripting languages (Python, Perl) for design automation.

  2. Experience with reliability analysis (electromigration, IR-drop, and thermal).

  3. Knowledge of high-speed data link and system budgets.

  4. Exposure to machine learning or AI methods for design optimization.

  5. Experience with Design Technology Co-Optimization(DTCO) and 3DIC integration of photonic systems.

Fostering a global inclusive workplace reflects TSMC's core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.



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