Senior Engineer

1 week ago

Taipei City, Taiwan Cisco Systems Full time $90,000 - $120,000 per year
Who You'll Work WithWho You AreKey Responsibilities:
  • Lead technical investigations for component failures across NPI, mass production, and field return stages.
  • Perform root cause analysis on high-speed interfaces including PCIe, Ethernet SERDES, DDR4/5, LPDDRx, HBMx, and NVMe/SATA/SAS components.
  • Work closely with Cisco's global teams and contract manufacturers to debug system-level failures involving SoCs (x86/ARM), power delivery, and signal integrity.
  • Understand use of advanced FA techniques such as curve tracing, X-ray, CSAM, OBRICH, SEM/EDX, FIB, and microprobing. Be able to understand when to apply what techniques and tools for targeted failure analysis in collaboration with FA labs and suppliers.
  • Collaborate with suppliers to define and verify corrective actions (8D, RC/CA reports).
  • As a component subject-matter expert, provide guidance to FA leads at Cisco CMs..
  • Participate in multi-functional reviews of component quality and reliability issues, technology and design reviews, yield excursions, and drive solutions to resolve failures.
  • Build and deliver clear FA reports and executive summaries with risk assessments and mitigation paths with excellent attention to details.
  • Support lab expansion or qualification and audits across regional test partners.
Required Qualifications:
  • Bachelor's or Master's degree in Electrical Engineering, Materials Science, Physics, or related discipline.
  • 5+ Experience in semiconductor quality, with knowledge in design, fabrication, characterization, qualification, testing, quality, reliability, failure analysis.
  • Strong technical background in analyzing and common failure modes impacting high-speed interfaces and ICs such as NPU ASICs, FPGA/CPLDs, SERDES-based PHYs, DRAM (DDRx/LPDDR), and storage (SATA, PCIe NVMe) architectures.
  • Deep understanding of FA tools and workflows (CSAM, SEM, X-ray, FIB, OBIRCH, etc.) and structured problem solving methods such as Fishbone, and 3x5 Whys, etc.
  • Experience working with contract manufacturers, ODMs, and semiconductor vendors in Taiwan or Asia.
  • Familiarity with JEDEC, IPC, and industry qualification standards.
  • Excellent written and verbal communication skills in English.
  • Ability to work independently, drive issues to closure, and influence multi-functional teams.

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