Senior Packaging Engineer
5 days ago
Job Description
Role Description:
A Senior Packaging Engineer/Manager at Ambarella is responsible for leading and executing advanced packaging development, focusing on substrate design verification, package design and process review, thermal and warpage control, and cross-functional collaboration. The role requires both technical expertise and project management skills to ensure timely delivery, cost-effectiveness, and high-quality outcomes in packaging
Key responsibilities:
1. Perform substrate design verification, review, and manufacturing follow-up to ensure compliance with product requirements.
2. Lead packaging design and process audits, ensuring manufacturability, reliability, and performance.
3. Conduct thermal simulations, warpage analysis, and implement control strategies to optimize package performance.
4. Collaborate with cross-functional teams including design, process, quality, and supply chain teams to resolve issues and drive project success.
5. Monitor and evaluate supplier performance in terms of delivery schedules, cost structure, and quality standards.
6. Provide technical guidance and mentorship to junior engineers and support decision-making for advanced packaging roadmaps.
Requirements:
• Education: Bachelor's degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, or related field.
• Experience:
- Minimum of 5 years of relevant experience in packaging engineering (substrate, assembly, or advanced packaging).
- Experience in substrate design verification and package process review.
- Hands-on experience with thermal simulation and warpage control methods.
• Skills:
- Strong knowledge of substrate manufacturing flow, package design methodologies, and reliability considerations.
- Ability to conduct and interpret thermal and warpage simulations, including shadow moiré data analysis.
- Understanding of cost, yield, and delivery aspects of substrate and packaging supply chain.
- Excellent communication and coordination skills for cross-functional teamwork.
- Ability to work under pressure with high accountability and attention to detail.
- Fluent in Chinese; English proficiency preferred.
-
Packaging Engineer
1 week ago
Hsinchu, Taiwan Advanced Micro Devices, Inc Full time NT$60,000 - NT$120,000 per yearWHAT YOU DO AT AMD CHANGES EVERYTHINGAt AMD, our mission is to build great products that accelerate next-generation computing experiences – from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create...
-
Hsinchu, Taiwan Qualcomm Full time NT$1,800,000 - NT$2,500,000 per yearCompany:Qualcomm Semiconductor LimitedJob Area:Engineering Group, Engineering Group > Packaging EngineeringQualcomm Overview:Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes...
-
Sr. Packaging Engineer
1 week ago
Hsinchu City, Taiwan Advanced Micro Devices, Inc Full time NT$120,000 - NT$240,000 per yearWHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create...
-
Hsinchu, Taiwan Qualcomm Full time NT$1,200,000 - NT$3,600,000 per yearCompany:Qualcomm Semiconductor LimitedJob Area:Engineering Group, Engineering Group > Packaging EngineeringQualcomm Overview:Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes...
-
Packaging Engineer
1 week ago
Hsinchu City, Taiwan Advanced Micro Devices, Inc Full time NT$60,000 - NT$120,000 per yearWHAT YOU DO AT AMD CHANGES EVERYTHINGAt AMD, our mission is to build great products that accelerate next-generation computing experiences – from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create...
-
Packaging Engineer
5 days ago
Hsinchu City, Taiwan Advanced Micro Devices, Inc Full time NT$60,000 - NT$120,000 per yearWHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create...
-
Hsinchu City,, Taiwan Qualcomm Full time NT$900,000 - NT$1,200,000 per yearCompanyQualcomm Semiconductor LimitedJob AreaEngineering Group, Engineering Group > Packaging EngineeringQualcomm OverviewQualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes...
-
Packaging Engineer
5 days ago
Hsinchu Metropolitan Area, Taiwan AMD Full time $60,000 - $120,000 per yearWHAT YOU DO AT AMD CHANGES EVERYTHINGAt AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create...
-
IC Package Layout Engineer
5 days ago
Hsinchu, Taiwan Qualcomm Full time NT$1,200,000 - NT$2,400,000 per yearCompany:Qualcomm Semiconductor LimitedJob Area:Engineering Group, Engineering Group > Packaging EngineeringGeneral Summary:Own and drive advanced package selection, new generation product package structure, and configuration optimization.Responsible for Package/SIP physical design and layout, optimization, DV, and tape out.Work with multi-functional teams to...
-
Packaging Engineer
1 week ago
Hsinchu City, Taiwan Advanced Micro Devices, Inc Full time NT$1,200,000 - NT$2,400,000 per yearWHAT YOU DO AT AMD CHANGES EVERYTHINGAt AMD, our mission is to build great products that accelerate next-generation computing experiences – from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create...